• Excellent Wetting
• Wide Process Window
• Tin-Lead and Lead-Free Compatible
• Used for Ball Attach

NC254 Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC254 Paste Flux may be used for general touch up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) packages. The superior wetting ability of NC254 Paste Flux results in bright, smooth and shiny solder joints whether reflowed by hand, hot-air rework station, convection reflow oven, or vapor phase soldering systems. Residues that remain on surfaces after soldering are clear, leaving a cosmetically appealing repair that can be easily pin probed during in-circuit test. NC254 Paste Flux is compatible with all tin-lead and lead-free alloys and is suitable for a wide range of applications. NC254 Paste Flux can be brushed, dispensed, pin transferred, or stencil printed. NC254 Paste Flux is available in 10cc and 30cc syringes.