• VOC-Free per ASTM D3960-98
• Passes IPC J-STD-004B
• Broad Process Window
• Withstands Extended Dwell Time
• Fast Wetting
• REACH/RoHS Compliant
• Low Post-Soldering Residue

NC275LR is a water-based, halide-free, no-clean liquid flux formulated to offer a wide process window with excellent wetting even on hard-to-wet and OSP surfaces. NC275LR offers a durable activator system accommodating a variety of process parameters and applications, including soldering with tin-silver-copper, tinsilver, tin-copper, and other lead free alloys. In addition, NC275LR is a low-odor, low-fume flux and provides rapid solvent evaporation. NC275LR is safe for palletized selective wave soldering and point-to-point selective soldering. NC275LR residues may be left on the circuit board after processing; residue removal is not required.

Application

NC275LR is formulated for application via spray or mist. Foaming is not recommended. NC275LR is ready to use directly from its container. When spray fluxing, proper flux coverage and uniformity are imperative. A dry flux coating of 500-1500 micrograms per square inch is recommended as a starting point. The use of nitrogen is not required but acceptable.