• Provides safe, rapid installation or removal of chip components, SOT's, SOIC's, PLCC's, QFP's and other surface-mounted devices via controlled convective/hot air.
• A finger-actuated air switch and IntelliHeat Control provide safe, "instant use" capability without the constant running of an air pump.
• The TJ-70's pencil grip design lets you target controlled heat right at the solder joints without affecting adjacent components solder or damaging the PC board.
• Effective for heat shink tubing applications and for conformal coating removal via convective softening of urethanes/over-curing of epoxies.
• For use on SensaTemp-compatible (PRC 2000, MBT 250, and older PACE stations) systems only.

Handpieces must be used with Pace stations.