Indium PASTEOT-801449-700g-T4 Solder Paste, No Clean, Lead Free, T4, 89%, SAC305, 700g Cartridge

• Ultra-low voiding, including bottom termination (BTC) assemblies
• Enhanced Electrical Reliability performance
• Outstanding solder beading, very low bridging, slump, solder balling, and head-in-pillow
• Exceptional printing—high transfer efficiency and low variation
• Halogen-free per IEC 61249-2-21, test method EN14582
• Excellent wetting to fresh and aged common metallizations and surface finishes, including, but not limited to: OSP, Immersion Sn, Immersion Ag, ENIG

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Indium10.1HF Ultra-Low Voiding Pb-Free Solder Paste

Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to have ultra-low voiding, especially for designs that incorporate large ground pads otherwise known as bottom termination components (BTCs). BTCs include packages such as QFNs, DPAKs, and MOSFETs. The flux chemistry is specifically engineered to improve reliability by minimizing voiding and maximizing ECM and head-in-pillow performance while also providing excellent wetting, solder beading, solder balling, and slump to meet IPC specifications. It is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry.