• Eliminates the need for cleaning
• Reduces solder ball formation
• Excellent solderability on standard board fi nishes and alternative coating

3541 No-Clean is a low-solids flux specially formulated to be used for wave soldering where the solder cleaning process has been eliminated. This flux contains a small amount of resin which enhances the wetting properties.

3541 No-Clean is activated by a multi-component, synergetic fluxing system, which improves solderability. Any post-soldering residues are considered non-corrosive.

3541 No-Clean leaves a “tack-free” surface and does not interfere with ATE testing.