• High transfer efficiency through small apertures (≤0.66 AR)
• Excellent wetting to all common finishes at high and low peak reflow temperatures
• Eliminates head-in-pillow defects
• High oxidation resistance

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Indium8.9 Pb-Free Solder Paste

Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace Pb-bearing solders. Indium8.9 offers excellent stencil print transfer efficiency to work in the broadest range of processes. In addition, the superior soldering performance under high temperature and long reflow processes provides exceptional head-in-pillow performance