• Good humidity resistance. Gives excellent coalescence even after 72 hours exposure to 27ºC/80% RH, reducing process variation due to environmental factors.
• Clear residues for easy post-reflow inspection.
• Soft, non-stick, pin testable residues allow easy in-circuit testing.
• Suitable for fine pitch, high speed printing up to 150mm/s (6"/s).
• Extended open time and tack-life leading to low wastage.
• Halide-free flux classification: ROL0 to ANSI/J-STD-004.

LF318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has a high tack force to resist component movement during high speed placement and long printer abandon times. LF318 shows excellent solderability over a wide range of reflow profiles in both air and nitrogen across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper.