• Halogen-free per EN14582 test method
• High transfer efficiency through small apertures (≤0.66AR)
• Eliminates hot and cold slump
• High oxidation resistance
• Wets well to oxidized BGA and pad surfaces to eliminate head-in-pillow defects
• Clear, probe testable flux residue
• SnPb and Pb-free compatible
• Ideal for mixed-alloy SnPb and Pb-free processes

Indium8.9HF SnPb Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Compatible Products
• Rework Flux: TACFlux® 089HF, TACFlux® 020B
• Cored Wire: CW-807
• Wave Flux: WF-9945, WF-9958

Note: Other products may be applicable