• Quantity: 25g in a 30cc syringe
• Designed for ball-mounting onto BGA and BGA sockets
• Typical tack strength: 149g
• Compatible alloys: All SnPb, most SAC alloys
• Typical viscosity: 282kcps
• Flux type classification: ROL0
• Excellent wetting ability in air reflow
• Wide reflow temperature range

Indium Corporation manufactures a complete line of TACFlux which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component attach (including BGAs and flip-chips), BGA ball-attach, preform soldering, and virtually any application where the flux is required. Cycle times are not critical as TACFlux may sit for hours with no-reflow degradation.
TACFlux 007, 018, and 023 can be printed or used in pin transfer applications. TACFlux 007, 018, and 023 are designed for no-clean applications. If necessary, the flux residue can be removed by using a semi-aqueous system, saponified water, alcohols, or other CFC-free alternatives. The shelf life of TACFlux® 007, 018, and 023 is 12 months when stored at 0–30°C. Flux should be allowed to reach ambient working temperature prior to use. Packaging should be labeled with the date and time of opening.