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Kester
Kester

Kester 300303 Tacky Soldering Flux, TSF-6592LV, No-Clean, ROL0, 30r Syringe

Our Part #KES-TSF6592LV-30G

Mfr Part #300303

Kester 300303
Kester
Kester

Kester 300303 Tacky Soldering Flux, TSF-6592LV, No-Clean, ROL0, 30r Syringe

Our Part #KES-TSF6592LV-30G

Condition:New

Mfr Part #300303

Next Day Air Only
CA Prop 65
Has Expiration Date
RoHS
$57.00EACH
Manufacturer Lead Time :25 Days
Qty:Price:Savings
1$57.00
5$55.29Save
10$54.15Save
25$53.01Save
100$52.55Save
Next Day Air Only
Calif. Prop 65
Has Expiration Date
RoHS
  • Compatible with Lead Free alloys such as SnAg, SnCu, SnAgCu,SnAgBi
  • Reflow-able with peak temperatures up to 270C
  • Reflow-able in air and nitrogen
  • Bright shiny soldered joints with clear residues
  • Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG
  • Clear non-tacky residues
  • High tack to minimize skewing of components
  • Low voiding
  • Stencil life of 8+ hours (process dependent)
  • Classified as ROL0 per J-STD-004A & J-STD-004B
  • Compliant to Bellcore GR-78

Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.

BrandKester
Flux TypeROL0
ApplicationsSoldering
CompositionProprietary Rosin, 1-(2-Butoxy-1-Methylethoxy)Propan-2-ol, Succinic Acid
Container Size30 g
Container TypeSyringe
Flash Point190°F
Flux CharacteristicsNo-Clean
Height1"
Length5"
OdorAromatic Solvents
Physical FormViscous
Product TypeSoldering Flux
Shelf Life120 days
Storage Temperature10°C
Viscosity235 poise Malcom Viscometer @ 10rpm and 25deg C
Width1"
$57.00EACH
Manufacturer Lead Time :25 Days
Qty:Price:Savings
1$57.00
5$55.29Save
10$54.15Save
25$53.01Save
100$52.55Save
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