Kester 300303 Tacky Soldering Flux, TSF-6592LV, No-Clean, ROL0, 30r Syringe
Our Part #KES-TSF6592LV-30G
Condition:New
Mfr Part #300303
Next Day Air Only
WARNING
Has Expiration Date
RoHS
$50.51Each-EA
Quantity on Order:36
Manufacturer Lead Time :18 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $50.51 | |
| 5 | $50.00 | Save |
| 10 | $48.99 | Save |
| 25 | $47.98 | Save |
| 100 | $46.97 | Save |
- Description
- Specifications
- Documents
- Compatible with Lead Free alloys such as SnAg, SnCu, SnAgCu,SnAgBi
- Reflow-able with peak temperatures up to 270C
- Reflow-able in air and nitrogen
- Bright shiny soldered joints with clear residues
- Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG
- Clear non-tacky residues
- High tack to minimize skewing of components
- Low voiding
- Stencil life of 8+ hours (process dependent)
- Classified as ROL0 per J-STD-004A & J-STD-004B
- Compliant to Bellcore GR-78
Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.
Brand: Kester
Flux Type: ROL0
Container Size: 30 g
Container Type: Syringe
Applications: Soldering
Composition: Proprietary Rosin, 1-(2-Butoxy-1-Methylethoxy)Propan-2-ol, Succinic Acid
Flash Point: 190°F
Flux Characteristics: No-Clean
Height: 1"
Length: 5"
Odor: Aromatic Solvents
Physical Form: Viscous
Product Type: Soldering Flux
Shelf Life: 120 days
Storage Temperature: 10°C
Viscosity: 235 poise Malcom Viscometer @ 10rpm and 25deg C
Width: 1"
$50.51Each-EA
Quantity on Order:36
Manufacturer Lead Time :18 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $50.51 | |
| 5 | $50.00 | Save |
| 10 | $48.99 | Save |
| 25 | $47.98 | Save |
| 100 | $46.97 | Save |