
$57.00EACH
Quantity on Order:25
Manufacturer Lead Time :19 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $57.00 | |
| 5 | $55.29 | Save |
| 10 | $54.15 | Save |
| 25 | $53.01 | Save |
| 100 | $52.55 | Save |
Condition:New
Next Day Air Only
Calif. Prop 65
Has Expiration Date
RoHS
- Description
- Specifications
- Documents
- Compatible with Lead Free alloys such as SnAg, SnCu, SnAgCu,SnAgBi
- Reflow-able with peak temperatures up to 270C
- Reflow-able in air and nitrogen
- Bright shiny soldered joints with clear residues
- Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG
- Clear non-tacky residues
- High tack to minimize skewing of components
- Low voiding
- Stencil life of 8+ hours (process dependent)
- Classified as ROL0 per J-STD-004A & J-STD-004B
- Compliant to Bellcore GR-78
Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.
Brand:Ā Kester
Flux Type:Ā ROL0
Container Size:Ā 30 g
Container Type:Ā Syringe
Applications:Ā Soldering
Composition:Ā Proprietary Rosin, 1-(2-Butoxy-1-Methylethoxy)Propan-2-ol, Succinic Acid
Flash Point: 190°F
Flux Characteristics:Ā No-Clean
Height:Ā 1"
Length:Ā 5"
Odor:Ā Aromatic Solvents
Physical Form:Ā Viscous
Product Type:Ā Soldering Flux
Shelf Life:Ā 120 days
Storage Temperature: 10°C
Viscosity:Ā 235 poise Malcom Viscometer @ 10rpm and 25deg C
Width:Ā 1"
$57.00EACH
Quantity on Order:25
Manufacturer Lead Time :19 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $57.00 | |
| 5 | $55.29 | Save |
| 10 | $54.15 | Save |
| 25 | $53.01 | Save |
| 100 | $52.55 | Save |
