
$57.00EACH
Manufacturer Lead Time :25 Days
Qty: | Price: | Savings |
---|---|---|
1 | $57.00 | |
5 | $55.29 | Save |
10 | $54.15 | Save |
25 | $53.01 | Save |
100 | $52.55 | Save |
Next Day Air Only
Calif. Prop 65
Has Expiration Date
RoHS
- Description
- Specifications
- Documents
- Compatible with Lead Free alloys such as SnAg, SnCu, SnAgCu,SnAgBi
- Reflow-able with peak temperatures up to 270C
- Reflow-able in air and nitrogen
- Bright shiny soldered joints with clear residues
- Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG
- Clear non-tacky residues
- High tack to minimize skewing of components
- Low voiding
- Stencil life of 8+ hours (process dependent)
- Classified as ROL0 per J-STD-004A & J-STD-004B
- Compliant to Bellcore GR-78
Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.
Brand: Kester
Flux Type: ROL0
Applications: Soldering
Composition: Proprietary Rosin, 1-(2-Butoxy-1-Methylethoxy)Propan-2-ol, Succinic Acid
Container Size: 30 g
Container Type: Syringe
Flash Point: 190°F
Flux Characteristics: No-Clean
Height: 1"
Length: 5"
Odor: Aromatic Solvents
Physical Form: Viscous
Product Type: Soldering Flux
Shelf Life: 120 days
Storage Temperature: 10°C
Viscosity: 235 poise Malcom Viscometer @ 10rpm and 25deg C
Width: 1"
$57.00EACH
Manufacturer Lead Time :25 Days
Qty: | Price: | Savings |
---|---|---|
1 | $57.00 | |
5 | $55.29 | Save |
10 | $54.15 | Save |
25 | $53.01 | Save |
100 | $52.55 | Save |