This material is designed for the potting, encapsulation, and coating of modules, relays, and a wide range of AC/DC converters, including high‑power and planar packages. It provides effective protection against moisture, dust, and other contaminants while increasing resistance to shock and vibration. Its low viscosity allows it to flow easily into complex geometries without trapping air, ensuring complete coverage of components. The pot life is compatible with processes that require combined dispensing or coating of Parts A and B. In addition, its dielectric properties are compatible with many electronic devices and help increase the overall breakdown voltage of the assembly.

• Two part, Clear, 1:1 Mix ratio (A:B)
• Pourable and self-leveling
• Cures at room temperature
• REACh and RoHS compliant
• Tested per UL-94 and passed V-1