Enhanced thermal conductivity to efficiently remove heat and improve overall reliability. Its low viscosity enables easy potting of complex geometries while minimizing air entrapment. A quick set-up time combined with a flexible cure schedule supports efficient manufacturing processes. It is well suited for applications such as potting sensors, relays, and other electronic components that require protection from vibration and harsh environmental conditions.

• Two part, Gray, 1:1 Mix ratio (A:B)
• Pourable and self-leveling
• Cures at room temperature
• REACh and RoHS compliant