Global Specialties GS-300 Solderless Breadboard

Features and Specifications

• 300 Tie-Point
• Maximum capacity of 1.5 A at 36 V
• ABS plastic body
• Nickel plated phosphor bronze spring clip contacts
• Allowable wire diameter of 0.4-0.7 mm
• Fits 3 total 16-pin ICs
• Measures 3.7 x 8.6 x 1.0 cm
• Peel and stick adhesive

A modular type solderless breadboard, the GS-300 connects with the GS-050 bus strip to make a 400 tie point breadboard (GS400). Expandable in two dimensions, it is a great way to prototype low frequency or DC powered circuits.