Kester 24-6337-8809 Solder Wire, No Clean, Leaded, Sn63Pb37, 1.1%, 0.025 in (0.60 mm), 245 Series

488SO6309 MFG #: 24-6337-8809
$29.60 / RL
0
  • Diameter: 0.025 in (0.60 mm)
  • Alloy: Sn63Pb37
  • Flux %: 1.1 %
  • Flux Type: No Clean
  • Lead Type: Leaded
  • Halogen Content: Halogen
  • Series: 245 Series
  • Core Size: 50
  • Description Price Table: SOLDER,WIRE,SN63 N/C P1
  • Drill Down Description: Solder Wire, No Clean, Leaded, Sn63Pb37, 1.1%, 0.025 in (0.60 mm), 245 Series
  • Model: 24-6337-8809
  • Package Type: Spool
  • Primary Keyword: Solid Wire
  • S3 Page Number Text: 122, 274, 278, 4, 420, 450, 484, 56
  • S3 Product Index: 412-884
  • Tin ~ Lead Alloy: 63/37
  • Weight: 1 lb (0.45 kg)

  • Description

    Kester 245 Flux-Cored Wire Product Overview:

    Alloy: Sn63Pb37

    Core Size: 50

    Flux: 1.1%

    Kester 245 was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 245 results in visually acceptable assemblies without cleaning, yet soldering quality and efficiency is comparable to that obtained with mildly activated rosin flux. 245 is classified as ROL0 per J-STD-004. 245 is Bellcore GR-78 compliant.

    Performance Characteristics:

    • Highy reliable post-soldering residue
    • Minimal residue
    • Compatible with leaded and lead free alloys
    • Classified as ROL0 per J-STD-004

    Cleaning

    The 245 flux residues are non-corrosive, non-conductive and do not require removal in most applications. IPA will not clean the residues off the surface of the circuit board after the soldering process. A saponifier or cleaning agent specifically designed to clean a no-clean flux is required to clean the residues.